Over its nearly 100-year history, Nokia Bell Labs has invented many of the foundational technologies that underpin information and communication networks and all digital devices and systems. This research has resulted in nine Nobel Prizes, four Turing Awards, three Japan Prizes and a plethora of National Medals of Science and Engineering, as well three Emmys, two Grammys and an Oscar for technical innovations. Nokia Bell Labs continues to conduct disruptive research focused on solving the challenges of the new digital era and innovating the technology that will define the next industrial revolution.
The successful applicant will join the Efficient Energy Transfer Department in Murray Hill, New Jersey (USA). This team performs cutting-edge research in the field of thermal management of next-generation telecommunications and computing systems across multiple scales (device-, board- and rack-levels). Research activities include: green thermal management solutions for datacenters, hybrid cooling for highly integrated telecommunications equipment, passive heat spreaders for foldable and wearable electronics, embedded thermal management solutions and temperature control for opto-electronics, artificial intelligence for two-phase cooling systems, and many others. The successful applicant would mainly work on a very exciting project focused on the development of a hyper efficient passive two-phase liquid-cooling technology for Nokia high-performance Edge datacenters.
The tasks would include a broad range of aspects from conception to development, including design, simulations / modeling, fabrication, testing and implementation of the new technology on a densified hardware. The student would be encouraged to present research findings through oral presentations within the company, as well as generate publications for the leading conferences and journals in the field of thermal sciences. Also, the intern would be encouraged to collaborate with other researchers, participate to discussions and work on new challenging applications in the field of advanced thermal management solutions, including hardware and software developments.